ENGINEER SWS-06 Superiot RMA Copper/Copper Alloy Precision Substrate Solder 0.6mm × 5.6m

This solder has been made to be highly reliable with the handle joints, and is highly washable and highly effective with resin inserts. Flux residue is completely non-corrosive so you don't need to clean substrates after soldering. The residue is non-conductive, non-hygroscopic, and is ideal for substrates with high density mounting without the occurrence of deterioration. Long lasting activity, excellent spread rate and solder wetness make work faster. Uses organic amine-based special active lozin (non-chlorine) Meets JIS-AA and MIL-RMA standards Copper alloy for precision circuit boards

• ENGINEER SWS-06 Non-cleaning type high-performance solder with solder that pursues high reliability of solder joints
• The activity lasts for a long time, and the excellent spread rate and the wettability of the solder make the work faster.
• Since the flux residue is completely non-corrosive, there is no need to clean the substrate after soldering.
• The residue is extremely non-conducting and non-hygroscopic, and is ideal for high-density mounting substrates without the occurrence of aging defects.
• Uses organic amine-based special active rosin (non-chlorine). Compatible with JIS-AA class and MIL-RMA standard.